rohs 2002/95/ec e 3 pb ds-cpc7557 - r02 www.clare.com 1 bridge characteristics features ? monolithic construction ? surface mount package applications ? telecommunications protection clamp ? high voltage multiplexer/switch description the CPC7557N is an integrated diode bridge built on clare?s high voltage soi technology. ordering information CPC7557N diagram parameter rating units reverse voltage 100 v forward current 240 ma rms part description CPC7557N 8-pin soic in tubes (50/tube) CPC7557Ntr 8-pin soic tape & reel (1000/reel) + - a/b b/a cpc7557 diode bridge
r02 www.clare.com 2 cpc7557 1 specifications 1.1 package pinout 1.2 pin description 1.3 absolute maximum ratings unless otherwise specified all electrical ratings are at 25 ? c 1 derate package for p diss 120 ? c/w. absolute maximum ratings are stress ratings. stresses in excess of these ratings can cause permanent damage to the device. functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. n /c n /c n /c - + 1 4 5 8 n /c b a pin# name description 1 ? negative bridge output 2n/c no connection 3n/c no connection 4+ positive bridge output 5a input a 6n/c no connection 7n/c no connection 8b input b parameter symbol minimum maximum units reverse voltage v rrm - 120 v diode forward current (average) i f - 250 ma rms diode forward surge current i fsm -2a fusing current i 2 t -0.02 a 2 s esd, human body model --3kv junction temperature 1 t j -+150 ? c storage temperature t stg -65 +150 ? c
3 www.clare.com r02 cpc7557 1.4 recommended operating conditions 1.5 general conditions typical values are characteristic of the device at 25 ? c and are the result of engineering evaluations. they are provided for information purposes only and are not part of the manufacturing testing requirements. unless otherwise noted, all electrical specifications are listed for t a =25 ? c. 1.6 dc electrical characteristics 1.7 ac electrical characteristics 2 typical performance data parameter symbol minimum maximum units diode forward current (average) i f - 240 ma rms reverse voltage v r - 100 v operating temperature range t a -40 +125 ? c thermal impedance ? ja 120 - ? c/w parameter conditions symbol minimum typical maximum units forward current - i f - - 240 ma rms diode forward voltage drop i f = 40ma v f 0.83 0.91 0.97 v i f = 250ma 1 1.3 1.49 reverse voltage leakage current v r =100v i r --1 ? a parameter conditions symbol minimum typical maximum units input zero bias capacitance v + ? v ? = 0v measured from v a to v b c ab -4.412pf output zero bias capacitance v a = v b measured from v + to v ? c +/ ? -8.320pf bridge zero bias capacitance v + ? v ? = 0v measured from v a to v +/- and v b to v +/- c a/+ , c a/ ? , c b/+ , c b/ ? -8.512pf 2. 8 2.6 2.4 2.0 1. 8 1.6 -20 20 60 -40 0 40 8 0 temperature (oc) diode forward volta g e (v) brid g e forward volta g e (v f ) vs. temperature 100 1.4 1.2 1.0 i f =250ma i f =40ma 2.2 1.6 1.4 1.2 1.0 0. 8 0.6 -20 20 60 -40 0 40 8 0 temperature (oc) diode forward volta g e (v) diode forward volta g e (v f ) vs. temperature 100 0.4 0.2 0 i f =250ma i f =40ma 152 150 14 8 146 144 142 -20 20 60 -40 0 40 8 0 temperature (oc) reverse breakdown volta g e (v) diode reverse breakdown volta g e (v rrm ) vs. temperature 100 140 13 8
r02 www.clare.com 4 cpc7557 3 manufacturing information 3.1 moisture sensitivity all plastic encapsulated se miconductor packages are susceptible to moisture ingression. clare classified all of its plastic encapsulated device s for moisture sensitivity according to the latest version of the joint industry standard, ipc/jedec j-std-020 , in force at the time of product evaluation. we test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and informat ion in that standard as well as to any limitations set forth in the information or standards referenced below. failure to adhere to the warnings or limitations as establ ished by the listed specificati ons could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. this product carries a moisture sensitivity level (msl) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard ipc/jedec j-std-033 . 3.2 esd sensitivity this product is esd sensitive , and should be handled according to the industry standard jesd-625 . 3.3 reflow profile this product has a maximum body temperature and time rating as shown below. all other guidelines of j-std-020 must be observed. 3.4 board wash clare recommends the use of no-clean flux formulations. however, board washing to remove flux residue is acceptable. the use of a short drying bake may be necessary if a wash is used after solder reflow processes. chlorine-based or fluorine-based solvents or fluxes shoul d not be used. cleaning methods that employ ultrasonic energy should not be used. device moisture sensitivity level (msl) rating CPC7557N msl 1 device maximum temperature x time CPC7557N 260 ? c for 30 seconds rohs 2002/95/ec e 3 pb
5 www.clare.com r02 cpc7557 3.5 8-pin soic package dimensions 3.6 tape & reel dimensions dimensions mm mi n / mm max (inches mi n / inches max) pcb land pattern 1.524 / 1.727 (0.060 / 0.06 8 ) 0.533 ref (0.021 ref) 0.1016 / 0.24 8 9 (0.0040 / 0.009 8 ) 4. 8 01 / 4.97 8 (0.1 8 9 / 0.196) pi n 1 0.356 / 0.457 (0.014 / 0.01 8 ) 5. 8 014 / 6.1976 (0.22 8 4 / 0.2440) 3. 8 10 / 3.9 88 (0.150 / 0.157) 1.27 typ (0.05 typ) 0.406 / 1.270 (0.016 / 0.050) 0.1905 / 0.24 8 9 (0.0075 / 0.009 8 ) 1.372 / 1.575 (0.054 / 0.062) 1.27 (0.050) 5.30 (0.209) 1.50 (0.059) 0.60 (0.024) dimensions mm (inches) note: tape dimensions not sho w n comply w ith jedec standard eia-4 8 1-2 em b ossment em b ossed carrier to p c o v er tape thickness 0.102 max. (0.004 max.) 330.2 dia. (13.00 dia.) k 0 = 2.10 (0.0 8 3) w =12.00 (0.472) b 0 =5.30 (0.209) user direction of feed a 0 =6.50 (0.256) p= 8 .00 (0.315) for additional information please visit our website at: www.clare.com clare, inc. makes no representations or warranties with respect to the accuracy or completeness of the contents of this publica tion and reserves the right to make changes to specifications and product descriptions at any time without notice. neither circuit patent licenses nor indemnity are expressed or implied. except as set forth in clare?s standard terms and conditions of sale, clare, inc. assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. the products described in this document are not designed, intended, authorized or warranted for use as components in systems in tended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of clare?s product may result in direct physical harm, i njury, or death to a person or severe property or environmental damage. clare, inc. reserves the right to discontinue or ma ke changes to its products at any time without notice. specification: ds-cpc7557 - r02 ?copyright 2011, clare, inc. all rights reserved. printed in usa. 8/17/2011
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